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| SPECIFICATION Character Type STN Dot Matrix LCD Module JM320240C SHENZHEN JINGHUA DISPLAYS CO.,LTD GENERAL SPECIFICATION 320 X 240 dot display Samsung LCD driver: S6B2086X01 Interface with 8-bit MPU (directly connected to Z80 serial MPU) Display Specification Display Mode: graphic, text and combination text-graphic mode Display Dot: 320 X 240 Display type: FSTN Display color-Display background color: White Polarizer mode:Positive. Viewing angle: 9:00 Display duty: 1/240 Driving bias: 1/16 Memory Transflective. and External Memory: A standard 160-word character generator ROM 64K external display RAM (static RAM) Mechanical characteristics (Unit:mm) Extenal dimension 166*109*13.1 View area 122.0*92.0 Dot size 0.33*0.33 Dot pitch 0.36*0.36 POWER: negative power;+5V power 2 Optical Characteristics (1) Definition of viewing Angle TOP TOP BOTTOM (2) Definition of Contrast Ratio: BOTTOM Contrast Ratio = standard A light source (3) Response Time Reflectance value of non-selected state brightness Reflectance value of selected state brightness Test condition : Response time is measured as the shortest period of time possible between the change in state of an LCD segment as demonstrated below 3 External Dimension(For LED backlight and touch panel) 4 External Dimension(For LED backlight) 5 TOUCH PANEL 6 LED Backlight Electrical/Optical Specifications: Symbol Forward Voltage Forward Currcnt Power Dissipation Reverse Vollage Reverse Current Luminous Intensity Luminous Uniformity Chromaticity Coordinate Emission Wavclength Spectral Range Vf If Pd Vr Ir Iv p Min. 70 X=0.298 Y=0.305 - Typ. 4.0 90 0.36 5.0 1.2 160.0 - Max. 120 X=0.328 Y=0.335 Unit V mA W V mA Cd/m2 % nm nm Conditions Vf=4.0V Vf=4.0V Vf=4.0V If=15mA Ta=25 Each Chip - - - Absolute Maximum Ratings At Ta=25 Parameter Power Dissipation Forward Current Reverse Voltage Operating Temperature Storage Temperature Symbol Pad Iaf Vr Topr Tstg -30 -40 Specification. 360 90 5 TO +85 TO +100 Unit mW mA V Remark Electrical/Optical Characteristics At Ta=25 Parameter Average Luminous Intensity Luminous Intensity Chrornaticity Coordinatc Y Forward Voltage Reverse Current Vf Ir 0.26 0.3 4.0 1.2 0.33 V mA Symbol Iv X Min. 150 70 0.29 Typ. 160 0.3 0.31 Max. Unit cd/m2 % Vf=4.0V Remark Vf=4.0V 7 Absolute Maximum Ratings ITEM Oprating temperature Storage temperature Input Voltage Supply voltage for Logic Supply voltage for LCD Static electricity Symbol Top Tst Vi Vdd-Vss Vdd-V0 Min 0 -20 -0.3 -0.3 -0.3 Type Max +50 +70 Vdd+0.3 +7.0 +30.0 V V V Unit Be sure that you are grounded when handing LCM Electrical Characteristics (Ta=25 , Vdd= 5.0V) Item Supply Voltage for logic Supply Voltage for LCD Input high voltage Input low voltage Output high voltage Output high voltage Supply Current for logic Frame frequency M signal frequency Symbol Vdd-Vss Vdd-V0 Vih Vil Voh Vol *Idd FLM Fm Ioh=0.4mA Iol=0.4mA Condition Standard Value min 2.7 0.8Vdd Vdd-0.4 35 35 Type 5.0 24.0 6 max 5.5 Vdd 0.2Vdd 0.4 10 150 150 Unit V V V V V V mA Hz Hz *Idd Measurement condition is for all pixels on display. 8 Block Diagram 9 8080 family interface timing 10 6800 family interface timing 11 AC CHARACTERISTICS 12 AC CHARACTERISTICS(CONTINUED) 13 AC CHARACTERISTICS(CONTINUED) 14 AC CHARACTERISTICS(CONTINUED) 15 OPERATION TIMING DIAGRAM 16 17 Pin assignment JP3: Pin NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Symbol D0 D1 D2 D3 /DISPOFF FLM NC LP CP VDD VSS VEE V0 FG X1 X2 Y1 Y2 NC A K NC NC NC H:ON L:OFF First LINE MARKER / LATCH PULSE DATA SHIFT2 POWER SUUPLY FOR LOGIC GND POWER SUUPLY FOR LCD OPERATING VOLTAGE LCD DRIVING FRAME GROUND TOUCH PANEL LOW SIGNAL IN Y AXIS TOUCH PANEL UPPER SIGNAL IN Y AXIS TOUCH PANEL RIGHT SIGNAL IN X AXIS TOUCH PANEL LEFT SIGNAL IN X AXIS / ANODE of LED UNIT CATHODE of LED UNIT / / / I/O I/O I/O I/O / / / / / / I P P P Data Bus Function I/O I/O I/O I/O I/O I I / 18 LCD Driving Source(1/16 Bias) V1=Vdd - 1/16Vlcd V2= Vdd - 2/16Vlcd V3=Vdd - 14/16Vlcd V4= Vdd - 15/16Vlcd V5= Vdd - Vlcd Dual Supply Voltage Types Vdd-V0: LCD Driving Voltage 19 Quality Units 1.Quality level 1.1 Inspection conditions 1.1.1The environmental conditions for inspection shall be as follows Room temperature: 225 Humidity : 6520%RH 1.1.2 The external visual inspection The inspection shall be performed by using a single 20W fluorescent lamp for illumination and the distance from LCD to eyes of the inspector should be 305cm. 1.1.3 Light method 1.1.4 Inspection distance and angle 20 Inspection should be performed within each X and Y axis. ( is usually 30 ) from Z axis to Inspection distance of any direction within display surface. must be kept 305cm to the 1.2 Sampling procedures for each item's acceptance level table Defect type Major defect Sampling procedures AQL 0.65 1.5 GB2828-87 single sampling plans for normal inspection. GB2828-87 single sampling plans for Minor defect normal inspection. 1.3 Classification of defects 1.3.1 Major defect A major defect refers to a defect that is considered to substantially degrade usability for product applications. 1.3.2 Minor defect A minor defect refers to a defect that is not considered to substantially degrade product application, or a defect that deviates from existing standards almost unrelated to the effective use of the product or its operation 2. Nonconforming Analysis and Deal With Manner 2.1 Nocconforming analysis (1)Customer should supply the detal data of nonconforming sample and the non-suitable sample. (2)After accepting detail data non-suitable sample from customer,the analysis of nonconforming should be finished in two weeks. 2.2 Deal with nonconforming (1)Both supplier and customer should analyze the reason together and discuss the disposition of nonconforming when the reason of 21 nonconforming is not sure. 3. Standard of The Product Appearance Test 3.1 manner of appearance test (1)The test must be under 20w*2 or 40w fluorescent light ,and the distance of view must be at 30 cm. (2)When test the model of transmissive product must add the reflective plate. (3)The test direction is base on about around 45 of vertical line. (4)Definition of area: A area: dots area. B area: out of dots area.(outside dots area) 3.2 basic principle: (1)it will accord to the AQL when the standard can not be described. (2)the sample of the lowest acceptable quality level must be discussed by both supplier and customer when any dispute happened. (3)must add new item on time when it is necessary. 3.3 standard of inspection (unit:mm) 22 NO Itms 01 Electrical testing 02 03 Black or white spots on LCD(display only) LCD black or white spots, (non-display) contamination (non-display) Criterion of defects AQL Display Missing,Short-circuit; No Display,Display malfunction; Current consumption exceeds product specifications; Major LCD viewing angle defect; Mixed product types; Contrast defect. White and black spots on display 0.25mm ,no more than three white or black spots Minor present. No more than two spots or lines within 3mm. D=(A+B)/2 Size D(mm) Acceptable number D 0.15 Ignore 0.15 0.20 0.25 Width (mm) D D D 0.20 0.25 0.30 Length (mm) L 3.0 L L L 2.0 2.0 3.0 3 2 1 Acceptabl e number 3 2 1 0 0 Minor Minor 04 Dark lines and scratches W 0.03 W W W W 0.05 0.08 0.1 0.03 0.05 0.08 0.1 Size D (mm) L>3.0 Ignore Acceptable number 3 2 0 Minor 05 D 0.20 bubble in 0.20 D polarizer 0.40 D 0.60 D 0.40 0.60 23 Dot type 06 Display Pattern Unit: mm (A+B)/2 0.25 C0 (D+E)/2 0.25 (F+G)/2 0.25 Note: 1) Acceptable up to 3 damages. 2) If there're two or more pinholes per digit, it is rejected. Minor 07 Chip in corner Minor a a 4mm b b W C c T Acceptable number 3 24 08 Chip in seal area a a 3mm b b 1.5mm c c 1/2T Acceptable number 3 Minor Chip is rejectable, if c is greater than 50% of the glass thickness or the seal area is damaged. 09 Chip pad(1) in Minor Acceptable number ignore 3 a a a 2mm 3mm b b b W/4 W/4 c c c T T 25 10 Chip pad(2) in Acceptable number ignore 3 Minor a a a 2mm 4mm b b b W/3 W/2 c c T T c 11 Chip in other sides a a a 3mm 4mm b b b 1mm 1.5mm b c c T T Acceptable number ignore 3 Minor 12 Glass rest Minor a 1/4W 26 1 2 13 Black light 3 4 1 2 3 4 PCB COB 14 5 6 7 8 1 15 Soldering 2 3 4 1 General appearance 2 3 4 16 lumimation source flikers when it. Spots or scratches that apper when lit must be judged using LCD spot,lines and contamination standards. Backlight doesn't light or color is wrong. Colour and luminance of backlight isn't permission to exceed criterion that customer affirmed. COB seal may not have pinholes larger than 0.2mm or contamination. COB seal surgace may not have pinholes through to the IC The height of the COB should not exceed the height indicated in the assembly diagram. There may not be more than 2mm of sealant outside the seal area on the PCB.And there should be no more than three places. No oxidation or contamination PCB terminals. Parts on PCB must be the same as on the production charactersitic chart.There should be no wrong parts,,,missing partsor excess parts. The jumper on the PCB should conform to the product characteristic chart. If solder gets on bezel tab pads, LED pad,zebra pad or screw hole pad,make sure it is smoothed down. No unmelted solder paste may be present on the PCB. No cold solder joints,missing solder connections,oxidation or icile. No short circuits in components on PCB. No short cicuits in components on PCB. No oxidation,contamiation,curves or, bends on interface Pin or TCP. No cracks on interface pin of TCP. No contamination.solder residue or solder balls on product. The IC on the TCP may not be damaged, circuits. 27 0.65 1.5 0.65 0.65 Minor Minor Major Minor Minor Major Minor Major Minor Minor Minor Major Minor Major Minor Mino r 3 The uppermost dege of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever. 6 The residual rosin or tin oil of sldering (compontnt or chip component) is not bumed into brown or black color. 7 Sealant on top of the ITO circuit has not hardeed . Pin type must match type in specification sheet. 8 LCD pin loose or missing pins. 9 10 Product packaging must the same as specified on packaging specification sheet. 11 Product dimension and structure must conform to product specification sheet. 12 The appearance of Heat Seal should not admit any dirt and break. Standard specification for reliability of LCD Module 5 Minor Minor Minor Major Major Major Major Major ITEM 1)High temperature operating 2)Low temperature operating 3)Humidity(witho ut polarizer) 4)High temperature storage 5)Low temperature storage 6)Thermal shock storage Condition 50 24h -30 8h 40 90%RH 240hours Criterion Total current consumption should be below double of initial value. Cosmetic defects should not be happened. 60 16hours -10 8hours -20 25 70 30min 5min 5min 5cycle 25 30min 28 7)Vibration (package state) 8)Shock test (package state) 10 150Hz 5m/s2 45min 50Hz amplitude :0.7mm 30min for each direction (X.Y.Z) 29 |
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